Feature | Capability |
---|---|
Quality Grade | Standard IPC 2 |
Number of Layers | 1 – 32layers |
Material | FR-4 Standard Tg 150°C, FR4-High Tg 170°C, FR4-High-Tg 180°C, FR4-Halogen-free, FR4-Halogen-free & High-Tg |
Order Quantity | 1pc – 10,000,000 pcs |
Min Tracing/Spacing | 3mil/3mil |
Surface Finish | HASL – Hot Air Solder Leveling Lead Free HASL – RoHS ENIG – Electroless Nickle/Immersion Gold – RoHS ENEPIG – Electroless Nickel Electroless Palladium Immersion Gold – RoHS Immersion Silver – RoHS Immersion Tin – RoHS OSP -Organic Solderability Preservatives – RoHS |
Solder Mask Sides | As per the file |
Solder Mask Color | Green, White, Blue, Black, Red, Yellow |
Silkscreen Color | White, Blue, Black, Red, Yellow |
Silkscreen Sides | As per the file |
NPTH Hole Size Tolerance | ±.002″ (±0.05mm) |
Min Annular Ring | 3mil |
Min Drilling Hole Diameter | 6mil, 4mil-laser drill |
Min Width of Cutout (NPTH) | 0.8mm |
Min Width of Slot Hole (PTH) | 0.6mm |
PTH Hole Size Tolerance | ±.003″ (±0.08mm) – ±4mil |
Surface/Hole Plating Thickness | 20μm – 30μm |
SM Tolerance (LPI) | .003″ (0.075mm) |
BGA Pitch | 0.2mm(8mil) |
Test | 10V – 250V, flying probe or testing fixture |
Aspect Ratio | 1.10 (hole size: board thickness) |
Impedance tolerance | ±5% – ±10% |
SMD Pitch | 0.2mm(8mil) |
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