Through holes on a PCB refer to a hole that is drilled from the top and through to the bottom of a PCB, these can be plated (PTH) or non-plated (NPTH). Through-hole technology, also spelled “thru-hole”, refers to the mounting scheme used for electronic components that involves the use of leads on the components that are inserted into holes drilled in PCBs and soldered to pads on the opposite side...

BGAs (Ball Grid Arrays) are SMD components with connections on the bottom of the component. Each pin is provided with a solder ball. All connections are distributed in a uniform surface grid or matrix on the component. Common grids are nowadays: 1.27 mm - 1.00 mm - 0.80 mm - 0.50 mm. With several hundred component connections, the number of „routable" pins is limited per layer. The inner pins of t...

Ball Grid Array (BGA): Features, Soldering Technique, and X-Ray Inspection Electronic devices are shrinking in size and increasing in complexity due to improvements in VLSI technology. The need for more interfacing input/output (I/O) leads and smaller device sizes have increased and this need can be met with the BGA (Ball Grid Array) package. Electronic devices are shrinking in size and increasing...

Though surface mount technology has become the main mounting method in PCB manufacturing, there are still some components that are not suitable in SMT assembly. Then SMT assembly and THT assembly need to be applied on the same board. This combination of assembly technologies is called a mixed assembly, which does not use solder paste during the manufacturing process. Most of the components are wel...