FR4 Standard Tg

Shengyi, ITEQ, KB, Nanya

FR4 Mid Tg (Lead Free Compatible)

Shengyi S1000, ITEQ IT158

FR4 High Tg (Lead Free Compatible)

Shengyi S1000-2, S1170
EMC EM827
Isola 370HR
ITEQ IT180A
Panasonic R1755V

High Performance Low Dk/Df

EMC EM828, EM888(S), EM888(K)
Isola FR408, FR408HR
Isola l-Speed, l-Tera MT
Nelco N4000-13EP,EPSI
Panasonic R5775 Megtron 6

RF Materials

Rogers RO4350, RO3010
Taconic RF-30, RF-35, TLC, TLX, TLY
Taconic 601, 602, 603, 605

Halogen Free

EMC EM285, EM370(D)
Panasonic R1566

Aluminum Backed PCB

Shengyi SAR20, Yugu YGA

Standard

Advanced

Standard

Advanced

Rigid-Flex & Flexible Circuits

Y

Y

Buried and Blind Vias

Y

Y

Sequential Lamination

Y

Y

Impedance Control

±10%

±5%

Hybrids & Mixed Dielectrics

Y

Y

Aluminum PCB’s

Y

Y

Non-Conductive Via Fill (VIP)

Y

Y

Conductive Via Fill

Y

Y

Cavity Boards

Y

Y

Backdrilling

Y

Y

Controlled Depth Drill and Rout

Y

Y

Edge Plating

Y

Y

Buried Capacitance

Y

Y

Etch Back

Y

Y

In-board Beveling

Y

Y

2-D Bar Code Printing

Y

Y

Standard

Advanced

Standard

Advanced

Maximum Layer Count

20

36

Maximum Panel Size

533x610mm
[21×24″]

610x1067mm
[24×42″]

Outer Layer Trace/Spacing(1/3oz starting foil+plating)

90μm/90μm
[0.0035″/0.0035″]

64μm/76μm
[0.0025″/0.003″]

Inner Layer Trace/Spacing(Hoz inner layer cu)

76μm/76μm
[0.003″/0.003″]

50μm/50μm
[0.002″/0.002″]

Maximum PCB Thickness

3.2mm[0.125″]

6.5mm[0.256″]

Minimum PCB Thickness

.20mm[0.008″]

.10mm[0.004″]

Minimum Mechancial Drill Size

.20mm[0.008″]

.10mm[0.004″]

Minimum Laser Drill Size

.10mm[0.004″]

.08mm[0.003″]

Maximum PCB Aspect Ratio

10:1

25:1

Maximum Copper Weight

5 oz[178μm]

6 oz[214μm]

Minimum Copper Weight

1/3 oz[12μm]

1/4 oz[9μm]

Minimum Core Thickness

50μm[0.002″]

38μm[0.0015″]

Minimum Dielectric Thickness

64μm[0.0025″]

38μm[0.0015″]

Minimum Pad Size Over Drill

0.46mm[0.018″]

0.4mm[0.016″]

Solder Mask Registration

±50μm[0.002″]

±38μm[0.0015″]

Minimum Solder Mask Dam

76μm[0.003″]

64μm[0.0025″]

Copper Feature to Edge, V-cut(30°)

0.40mm[0.016″]

0.36mm[0.014″]

Copper Feature to PCB Edge,Routed

0.25mm[0.010″]

0.20mm[0.008″]

Tolerance on Overall Dimensions

±100μm[0.004″]

±50μm[0.002″]

Standard

Advanced

Standard

Advanced

Minimum Microvia Hole Size

100μm[0.004″]

75μm[0.003″]

Capture Pad Size

0.25mm[0.010″]

0.20mm[0.008″]

Glass Reinforced Dielectrics

Y

Y

Maximum Aspect Ratio

0.7:1

1:1

Stacked Microvias

Y

Y

Copper Filled Microvias

Y

Y

Buried Filled Vias

Y

Y

Maximum No. of Buildup Layers

3+N+3

5+N+5